How BE Semiconductor Industries (BESIY) Is Turning Hybrid Bonding Demand Into a Bigger AI Packaging Growth Target
Key takeaways
- (OTC:BESIY) is one of the fastest-growing high-bandwidth memory stocks to buy.
- The update also followed a strong Q1 2026, when revenue rose 28.3% year over year to €184.9 million, and orders jumped 104.5%, helped by hybrid bonding, mobile, and photonics demand.
- Close-up of Silicon Die are being Extracted from Semiconductor Wafer and Attached to Substrate by Pick and Place Machine.
How BE Semiconductor Industries (BESIY) Is Turning Hybrid Bonding Demand Into a Bigger AI Packaging Growth Target Habib Ur Rehman Tue, June 23, 2026 at 11:10 PM GMT+7 2 min read BESI.AS BESIY BESVF BE Semiconductor Industries N.V. (OTC:BESIY) is one of the fastest-growing high-bandwidth memory stocks to buy. The company strengthened its HBM-adjacent case on June 18, 2026, when it raised its long-term revenue target to €1.7 billion to €2.2 billion from €1.5 billion to €1.9 billion at its 2026 Investor Day. BE Semiconductor tied the higher target to improved order momentum since Q2 2025, rising demand for 2.5D AI-related datacenter and photonics applications, and new hybrid bonding use cases in logic, memory, and co-packaged optics. That is directly relevant to HBM because advanced AI chips increasingly depend on tighter integration between processors, memory stacks, and packaging technologies.
The update also followed a strong Q1 2026, when revenue rose 28.3% year over year to €184.9 million, and orders jumped 104.5%, helped by hybrid bonding, mobile, and photonics demand. BE Semiconductor is not a memory producer, but its bonding tools place it close to the manufacturing bottlenecks behind AI memory and advanced packaging.
Close-up of Silicon Die are being Extracted from Semiconductor Wafer and Attached to Substrate by Pick and Place Machine. Computer Chip Manufacturing at Fab. Semiconductor Packaging Process.